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February 2021

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Subject:
PCBA Delamination
From:
Datacom - Juliano Ribeiro <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Datacom - Juliano Ribeiro <[log in to unmask]>
Date:
Thu, 18 Feb 2021 15:27:18 -0300
Content-Type:
text/plain
Parts/Attachments:
text/plain (42 lines) 
Hello to all

 

We have problems with delamination in our PCBA and we would like to test to
discover the root cause.

What are the suggestions about test to discover the root cause? The goal is
to discover if the root cause is internal or it is supplier.

 

I saw in the IPC600 and found IPC-TM-650 2.4.28.1, does anyone know this
test and if that test finds the root cause?

 

In particular we could send the images about problems

 

Thank you a lot

 

Juliano Bettim Ribeiro

DATACOM

Engenharia de Processos
Rua América, 1000, Bairro Industrial, Eldorado do Sul, RS - 92990-000
Telefone: +55 51 39333000 - Ramal 3484

Telefone Celular: +55 51 98446-2135

Fax: +55 51 39333003
site:    <http://www.datacom.ind.br/> www.datacom.ind.br
e-mail:   <mailto:[log in to unmask]>
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