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October 2020

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Subject:
From:
Datacom - Juliano Ribeiro <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Datacom - Juliano Ribeiro <[log in to unmask]>
Date:
Thu, 29 Oct 2020 14:15:11 -0300
Content-Type:
text/plain
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text/plain (39 lines)
Hello to all

 

We are having trouble assembling a component (SMD QSFP28 – Belly to Belly)
because we need to mount it on the bottom side and the component falls into
the oven.

We would like to discard the option of using adhesive, so do you suggest
something?

 

p.s.: we have images but it isn’t possible to attached in this email, but
after we could send by private email.

 

Thank you

 

Juliano Bettim Ribeiro

DATACOM

Engenharia de Processos
Rua América, 1000, Bairro Industrial, Eldorado do Sul, RS - 92990-000
Telefone: +55 51 39333000 - Ramal 3484

Telefone Celular: +55 51 98446-2135

Fax: +55 51 39333003
site:    <http://www.datacom.ind.br/> www.datacom.ind.br
e-mail:   <mailto:[log in to unmask]>
[log in to unmask]

 

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