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August 2020

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TechNet <[log in to unmask]>
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Date:
Mon, 3 Aug 2020 06:21:54 -0500
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TechNet E-Mail Forum <[log in to unmask]>, Nigel Burtt <[log in to unmask]>
Subject:
Rogers 3000 series laminates
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Nigel Burtt <[log in to unmask]>
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Anyone have any PCB assembly process experiences positive and negative for the PTFE/Ceramic based laminates in the Rogers 3000 series (specifically RO3006 and RO3010) compared to "standard" FR4 types

eg with respect to handling and storage, behaviour in solder reflow/rework, router or laser depanelling, etc etc

I'd be obliged if you point me to any caveats/gotchas

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