Yes they do. Turns out this was a Amkor design they called a Fusion
package, and I was able to find an application note, but it's pretty
general and not very specific:

http://ww1.microchip.com/downloads/en/Appnotes/VPPD-02781.pdf

I'm afraid this will be another one of those; "Well, let's try this and see
what happens..."

Steve

On Thu, Jun 25, 2020 at 11:19 AM <[log in to unmask]> wrote:

> Microsemi seem to go out of their way to design PIA parts to solder 😊
>
> -----Original Message-----
> From: TechNet <[log in to unmask]> On Behalf Of Steve Gregory
> Sent: Thursday 25 June 2020 18:11
> To: [log in to unmask]
> Subject: Re: [TN] [External] [TN] Soldering Microsemi VSC8522XJQ-02?
>
> Hi Dave,
>
> Thanks, that's what I thought. I've been through Microsemi's site to try
> and find some sort of footprint or application notes or something to help,
> and there isn't anything I can find.
>
> Funny thing about this is, is that this part is coming with a new board
> that we're quoting and it's supposed to be for a new prototype, but the
> last time buy for this part is this coming August! Sheesh!
>
> Probably not making it anymore because nobody wants it because it's such a
> PIA to solder!
>
> Steve
>
> On Thu, Jun 25, 2020 at 10:59 AM David Hillman <[log in to unmask]>
> wrote:
>
> > Hi Steve - I took a quick look at the component and if the intent of
> > the package design is to have that center pad soldered to the assembly
> > then run! As you mentioned, trying to get a solder paste/solder
> > wetting balance between the center pad and the outer I/O pads is a
> > nightmare. A QFN would be easier to solder than this package.
> >
> > Dave Hillman
> > Collins Aerospace
> >
> > On Thu, Jun 25, 2020 at 11:44 AM Steve Gregory <[log in to unmask]>
> wrote:
> >
> >> Hi All,
> >>
> >> I just ran across a new part that I've never seen before from
> >> Microsemi, it's part number VSC8522XJQ-02. Microsemi calls it a TQFP
> >> package, but's not like any TQFP package I've seen. Well, actually
> >> I've seen something almost like it from quite a while ago from LSI
> >> Logic I think it was, they called a "Fusion" package. It had dual
> >> rows of leads like this does, one set on the outer perimeter, and
> >> another set inside around the middle of the body like this one does.
> >> But this one has a thermal pad like a QFN and the two sets of leads
> >> are on different pitches, and different types. The perimeter leads
> >> are gull wing, and the inner pattern pads ar like rounded rectangle
> >> BGA pads.
> >>
> >> I remember that the fusion part took me three versions of stencils to
> >> get the part to solder right even when the manufacturers
> >> recommendations were first followed. I'm hoping I don't have to go
> >> through that drill again with this part. I'm hoping that someone out
> >> there in "Technet Land" has used this part before and can set this
> >> old fart's mind at ease...
> >>
> >> TIA,
> >>
> >> Steve
> >>
> >> --
> >> Steve Gregory
> >> Kimco Design and Manufacturing
> >> Process Engineer
> >> (208) 322-0500 Ext. -3133
> >>
> >> --
> >>
> >>
> >>
> >> This email and any attachments are only for use by the intended
> >> recipient(s) and may contain legally privileged,  confidential,
> >> proprietary or otherwise private information. Any unauthorized use,
> >> reproduction, dissemination, distribution or other disclosure of the
> >> contents of this e-mail or its attachments is strictly  prohibited.
> >> If you have received this email in error, please notify the  sender
> >> immediately and delete the original.
> >>
> >
>
> --
> Steve Gregory
> Kimco Design and Manufacturing
> Process Engineer
> (208) 322-0500 Ext. -3133
>
> --
>
>
>
> This email and any attachments are only for use by the intended
> recipient(s) and may contain legally privileged,  confidential,
> proprietary or otherwise private information. Any unauthorized use,
> reproduction, dissemination, distribution or other disclosure of the
> contents of this e-mail or its attachments is strictly  prohibited. If you
> have received this email in error, please notify the  sender immediately
> and delete the original.
>
>

-- 
Steve Gregory
Kimco Design and Manufacturing
Process Engineer
(208) 322-0500 Ext. -3133

-- 



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