Hi Dave,

Thanks, that's what I thought. I've been through Microsemi's site to try
and find some sort of footprint or application notes or something to help,
and there isn't anything I can find.

Funny thing about this is, is that this part is coming with a new board
that we're quoting and it's supposed to be for a new prototype, but the
last time buy for this part is this coming August! Sheesh!

Probably not making it anymore because nobody wants it because it's such a
PIA to solder!

Steve

On Thu, Jun 25, 2020 at 10:59 AM David Hillman <[log in to unmask]>
wrote:

> Hi Steve - I took a quick look at the component and if the intent of the
> package design is to have that center pad soldered to the assembly then
> run! As you mentioned, trying to get a solder paste/solder wetting balance
> between the center pad and the outer I/O pads is a nightmare. A QFN
> would be easier to solder than this package.
>
> Dave Hillman
> Collins Aerospace
>
> On Thu, Jun 25, 2020 at 11:44 AM Steve Gregory <[log in to unmask]> wrote:
>
>> Hi All,
>>
>> I just ran across a new part that I've never seen before from Microsemi,
>> it's part number VSC8522XJQ-02. Microsemi calls it a TQFP package, but's
>> not like any TQFP package I've seen. Well, actually I've seen something
>> almost like it from quite a while ago from LSI Logic I think it was, they
>> called a "Fusion" package. It had dual rows of leads like this does, one
>> set on the outer perimeter, and another set inside around the middle of
>> the
>> body like this one does. But this one has a thermal pad like a QFN and the
>> two sets of leads are on different pitches, and different types. The
>> perimeter leads are gull wing, and the inner pattern pads ar like rounded
>> rectangle BGA pads.
>>
>> I remember that the fusion part took me three versions of stencils to get
>> the part to solder right even when the manufacturers recommendations were
>> first followed. I'm hoping I don't have to go through that drill again
>> with
>> this part. I'm hoping that someone out there in "Technet Land" has used
>> this part before and can set this old fart's mind at ease...
>>
>> TIA,
>>
>> Steve
>>
>> --
>> Steve Gregory
>> Kimco Design and Manufacturing
>> Process Engineer
>> (208) 322-0500 Ext. -3133
>>
>> --
>>
>>
>>
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>

-- 
Steve Gregory
Kimco Design and Manufacturing
Process Engineer
(208) 322-0500 Ext. -3133

-- 



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