Via in pad can either be HDI, as in laser micro via, or conventionally
drilled/filled/capped per IPC 4761 Type VII.
HDI is typically dictated by very fine pitch BGA components where
conventional vias will not fit and for very high density designs. External
copper thickness is typically limited to 1/2oz maximum due to the laser
drilling process.
IPC 4761 Type VII can be used in high density designs with conventional
vias. It enables placing vias in pad without causing manufacturability or
quality problems. Unlike HDI, Type VII vias can be specified for designs
requiring various copper thicknesses making it suitable for high current
designs.
Hth,
Dave
On Fri, Jun 19, 2020 at 12:00 AM TechNet automatic digest system <
[log in to unmask]> wrote:
> There are 3 messages totaling 93 lines in this issue.
>
> Topics of the day:
>
> 1. Via in Pad Terms and Definitions BGAs (3)
>
> ----------------------------------------------------------------------
>
> Date: Thu, 18 Jun 2020 11:09:20 +0000
> From: [log in to unmask]
> Subject: Via in Pad Terms and Definitions BGAs
>
> Fellow TechNetters:
>
> I would like a clarification in the following Terms:
>
> Is Via In Pad, VIP, considered a micro via? A typical microvia has a
> capture land (where the via STARTS) and a smaller target land (where the
> via ENDS.).
> IPC-7095 5.1.3 Layering (Multilayers, Sequential or Build-Up)
>
> Victor,
>
> ------------------------------
>
> Date: Thu, 18 Jun 2020 10:25:59 -0400
> From: Robert Kondner <[log in to unmask]>
> Subject: Re: Via in Pad Terms and Definitions BGAs
>
> Victor,
>
> My 2 cents would be yes, a via in a pads is a micro via. And it is filled
> and capped.
>
> Now if you have a really big pad ......
>
> Bob K.
>
> -----Original Message-----
> From: TechNet <[log in to unmask]> On Behalf Of [log in to unmask]
> Sent: Thursday, June 18, 2020 7:09 AM
> To: [log in to unmask]
> Subject: [TN] Via in Pad Terms and Definitions BGAs
> Importance: High
>
> Fellow TechNetters:
>
> I would like a clarification in the following Terms:
>
> Is Via In Pad, VIP, considered a micro via? A typical microvia has a
> capture land (where the via STARTS) and a smaller target land (where the
> via
> ENDS.).
> IPC-7095 5.1.3 Layering (Multilayers, Sequential or Build-Up)
>
> Victor,
>
> ------------------------------
>
> Date: Thu, 18 Jun 2020 07:30:54 -0700
> From: Morgan Viggers <[log in to unmask]>
> Subject: Re: Via in Pad Terms and Definitions BGAs
>
> While almost every via has a pad, the term "via in pad" typically means
> that
> a via is present inside a SOLDER pad. It can apply to a microvias, but is
> not limited to them, can also apply to thru-vias. From a PCB fab
> standpoint, via-in-pads are typically filled and overplated to provide a
> planar soldering surface.
>
> Morgan Viggers
> Field Applications Engineer
> ISU Petasys
> 503.675.3877
>
> -----Original Message-----
> From: [log in to unmask] [mailto:[log in to unmask]]
> Sent: Thursday, June 18, 2020 4:09 AM
> To: [log in to unmask]
> Subject: [TN] Via in Pad Terms and Definitions BGAs
>
> Fellow TechNetters:
>
> I would like a clarification in the following Terms:
>
> Is Via In Pad, VIP, considered a micro via? A typical microvia has a
> capture land (where the via STARTS) and a smaller target land (where the
> via
> ENDS.).
> IPC-7095 5.1.3 Layering (Multilayers, Sequential or Build-Up)
>
> Victor,
>
> ------------------------------
>
> End of TechNet Digest - 17 Jun 2020 to 18 Jun 2020 (#2020-90)
> *************************************************************
>
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