Subject: | |
From: | |
Reply To: | |
Date: | Thu, 18 Jun 2020 07:30:54 -0700 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
While almost every via has a pad, the term "via in pad" typically means that
a via is present inside a SOLDER pad. It can apply to a microvias, but is
not limited to them, can also apply to thru-vias. From a PCB fab
standpoint, via-in-pads are typically filled and overplated to provide a
planar soldering surface.
Morgan Viggers
Field Applications Engineer
ISU Petasys
503.675.3877
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Thursday, June 18, 2020 4:09 AM
To: [log in to unmask]
Subject: [TN] Via in Pad Terms and Definitions BGAs
Fellow TechNetters:
I would like a clarification in the following Terms:
Is Via In Pad, VIP, considered a micro via? A typical microvia has a
capture land (where the via STARTS) and a smaller target land (where the via
ENDS.).
IPC-7095 5.1.3 Layering (Multilayers, Sequential or Build-Up)
Victor,
|
|
|