Hi Joyce-

Whatever is used, the adhesion criteria I listed previously must be
validated. If I were to attempt this, I think I'd try a moderately
aggressive plasma clean to the bonding surfaces involved--that would help
with underfill wicking as well as adhesion. I can tell you that when you
get those "solder squirt" short circuits, it is not a good day!

Wayne Thayer

On Tue, Jun 16, 2020 at 3:53 AM Yuan-chia Joyce Koo <[log in to unmask]>
wrote:

> is this close enough?  https://www.indium.com/technical-documents/
> other-documents/download/495/
> indium also has no residue flux for flip chip - you might be able to
> use it without cleaning prior to underfill.  it is not the same thing
> as one step, but possibly the best for two steps ;-).
> fyi only.
> jk
> On Jun 15, 2020, at 11:16 AM, Richard Kraszewski wrote:
>
> > I have a potential need for a reflow encapsulant for a BGA
> > Had reached out  to Henkel  but was informed that they had
> > discontinued that  product line.
> > Anyone have a different source?
> >
> > Rich  Kraszewski
> > Senior Staff Process Engineer
> > Plexus
> >
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