is this close enough?  https://www.indium.com/technical-documents/ 
other-documents/download/495/
indium also has no residue flux for flip chip - you might be able to  
use it without cleaning prior to underfill.  it is not the same thing  
as one step, but possibly the best for two steps ;-).
fyi only.
jk
On Jun 15, 2020, at 11:16 AM, Richard Kraszewski wrote:

> I have a potential need for a reflow encapsulant for a BGA
> Had reached out  to Henkel  but was informed that they had   
> discontinued that  product line.
> Anyone have a different source?
>
> Rich  Kraszewski
> Senior Staff Process Engineer
> Plexus
>
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