42% is rather high for non-functional - are you sure it is not some  
kind of shielding for high speed?  or enhanced thermal transfer?   
without X-ray image of internal package, hard to say (you might dig  
out from the device provider's patent or application notes - if you  
don't have designer's contact number ;-).
jk
On Feb 24, 2020, at 12:01 PM, <[log in to unmask]>  
<[log in to unmask]> wrote:

> Fellow TechNetters,
>
>    Is there an industry standard/guideline for the number of  
> sacrificial solder bumps versus total solder bump count.   For  
> instance, 64 sacrificial and 88 active bumps for a total of 152  
> bumps (42%)?
> In advance I thank you for your timely response in this matter.
>
> Victor,