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February 2020

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Subject:
Sacrificial solder bump ratio in Nand gate BGA device
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Date:
Mon, 24 Feb 2020 17:01:55 +0000
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Fellow TechNetters,



   Is there an industry standard/guideline for the number of sacrificial solder bumps versus total solder bump count.   For instance, 64 sacrificial and 88 active bumps for a total of 152 bumps (42%)?

In advance I thank you for your timely response in this matter.



Victor,

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