Without the Ni barrier, the copper will diffuse through the gold rendering it unsolderable. -----Original Message----- From: TechNet <[log in to unmask]> On Behalf Of Steve Smith Sent: Monday, January 27, 2020 2:32 PM To: [log in to unmask] Subject: [EXT] [TN] Is Nickel really needed under the gold plating on copper? Hi All, I was asked today if nickel is really needed under the gold for plating on copper. I have understood it that the layer of nickel provides a mechanical backing for the gold layer and that it was also needed for the soldering process. Is this correct and is it the only reason it is used? My regards, Steve Smith Design Drafting Group Manager Staco Energy Products O: 937.253.1191 x158 | F: 937.253.1723 website<http://www.stacoenergy.com/company/corporate-profile.html?utm_source=signature&utm_medium=email&utm_campaign=website> | map<http://www.stacoenergy.com/corporate-headquarters.html?utm_source=signature&utm_medium=email&utm_campaign=map> | LinkedIn<https://www.linkedin.com/company/staco-energy?trk=ppro_cprof> [cid:Healthcare-1908_840361ac-17f2-4e80-b79c-638c2e56eb87.png]<http://www.stacoenergy.com/products-solutions/industries/healthcare.html?utm_source=signature&utm_medium=email&utm_campaign=healthcare><http://www.stacoenergy.com/services/service-offerings.html?utm_source=signature&utm_medium=email&utm_campaign=Promo_Service-1903> How are we doing? Take our survey<https://www.surveymonkey.com/r/XHK8G93>.
