TechNetters,
We reviewed documentation from a flexible PCB manufacturer and saw that
they recommend baking of the flex boards prior to assembly even if they
are brand new boards in a Moisture Barrier Bag.
Why wouldn't these be handled like any other moisture sensitive
component?
How many of you that work with flexible PCBs are baking them even if
they come out of a MBB with A HIC card that shows no real moisture?
Thank You,
Jerry Dengler
Production Manager
Pergamon Corporation
380 Crooked Lane, Unit# 3
King of Prussia, PA 19406-2567
U.S.A.
(610) 239-0721 Phone