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August 2019

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From:
Grossmann, Günter <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Grossmann, Günter <[log in to unmask]>
Date:
Fri, 23 Aug 2019 12:24:08 +0000
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Hi Peter

Maybe that I am not academic enough but "Dielectric Constant" is still the term we are using. In the textbooks I am aware of the term is clearly defined.

Have a nice weekend

Günter

Günter Grossmann
Scientist
Empa
Swiss Federal Laboratories for Materials Science and Technology
Überlandstrasse 129
8600 Dübendorf
Switzerland
Tel +41 58 765 42 79
[log in to unmask]
www.empa.ch

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-----Ursprüngliche Nachricht-----
Von: TechNet <[log in to unmask]> Im Auftrag von Peter Swanson
Gesendet: Freitag, 23. August 2019 13:59
An: [log in to unmask]
Betreff: [TN] Dielectric constant

I would appreciate some feedback on terminology. This applies to specifications for pcb laminates, coatings and encapsulants, etc.

My colleagues have come across a directive from the Institute of Electronic and Electrical Engineers (IEEE) about language, and other supporting references (https://en.wikipedia.org/wiki/Relative_permittivity). "Dielectric Constant" is now basically a struck-off/obsolete term as its meaning has become too imprecise through misuse over the years. "Relative Permittivity" is the phrase that engineers should be using rather than "dielectric constant" as it has a more precise definition of the permittivity of a material in relation to the permittivity of a vacuum.

My question is - what is in actual use at the coalface? Is this just stuff academics have said? Are you aware of this distinction? Are the latest data sheets you get still using "dielectric constant"? Some of the ones I see still use it.

Just some musings on a Friday afternoon...

Best,
Peter



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