no. it should not be flipped over for another 10sec. But we do specified suppliers to dip it twice or even 3rd time. depends on our requirements

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From: [log in to unmask] <[log in to unmask]>
Date: 26 August 2019 at 6:19:41 PM SGT
To: [log in to unmask] <[log in to unmask]>
Subject: [TN] TM-650 2.6.8, Thermal Stress, Plated Through Holes.

Fellow TechNetters:

   Requesting clarification on the above stated TM.

   Section 5.6  Using tongs, carefully remove the test specimen from the solder and place it on a piece of insulator to cool to room temperature ( see 6.3).
Question:       Is the test specimen not FLIP after each 10 second excursion as to ensure that both sides of the test specimen touch the molten solder surface.

Victor,