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Date: | Fri, 23 Aug 2019 11:28:52 +0000 |
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Fellow TechNetters:
I did not receive any feedback on my first inquiry. Therefore, I submit my request below again.
Victor,
From: Hernandez, Victor G
Sent: Thursday, August 22, 2019 10:14 AM
To: TechNet E-Mail Forum
Cc: Hernandez, Victor G
Subject: IPC-TM-650 - 2.6.8, 06/04 Rev: E, D-33a, Thermal stress, Plated Through Holes
Fellow TechNetters:
Is it valid/acceptable/permissible/allowable to conduct the above stated Test Method on a raw board with a final surface finish of LF HASL?
All comments and suggestion welcomed.....
Victor,
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