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August 2019

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Subject:
Re: TYPE III vs TYPE V vias
From:
Yuan-chia Joyce Koo <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Yuan-chia Joyce Koo <[log in to unmask]>
Date:
Wed, 21 Aug 2019 10:54:45 -0400
Content-Type:
text/plain
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text/plain (18 lines) 
never see a green type of via fill material with my limited  
experience.  May be new.  Can you find out which product is it? thx.
jk
On Aug 21, 2019, at 9:40 AM, Jack Olson wrote:

> Greetings,
> We are using thermal vias in large power device pads to carry heat  
> through
> the board to the back side.
> We specified TYPE V hole filling with non-conductive, but some of  
> the holes
> are open.
> If some of the vias are only partially filled, does that  
> automatically make
> it TYPE III?
> Is the same MATERIAL used for TYPE III and Type V via filling?
> (for the record, it is green and looks like soldermask material)

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