never see a green type of via fill material with my limited
experience. May be new. Can you find out which product is it? thx.
jk
On Aug 21, 2019, at 9:40 AM, Jack Olson wrote:
> Greetings,
> We are using thermal vias in large power device pads to carry heat
> through
> the board to the back side.
> We specified TYPE V hole filling with non-conductive, but some of
> the holes
> are open.
> If some of the vias are only partially filled, does that
> automatically make
> it TYPE III?
> Is the same MATERIAL used for TYPE III and Type V via filling?
> (for the record, it is green and looks like soldermask material)