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August 2019

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TechNet <[log in to unmask]>
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TechNet E-Mail Forum <[log in to unmask]>, Jack Olson <[log in to unmask]>
Date:
Tue, 27 Aug 2019 16:33:55 -0700
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TechNet E-Mail Forum <[log in to unmask]>, Stephen Pierce <[log in to unmask]>
Subject:
Re: TYPE III vs TYPE V vias
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Stephen Pierce <[log in to unmask]>
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<[log in to unmask]>
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Area array pad over a plated via (blind or through) is the most common reason

On Tue, Aug 27, 2019 at 3:49 PM Jack Olson <[log in to unmask]> wrote:
>
> When are caps on filled vias required by an application?

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