Fellow TechNetters:



   Requesting clarification on the above stated TM.



   Section 5.6  Using tongs, carefully remove the test specimen from the solder and place it on a piece of insulator to cool to room temperature ( see 6.3).

Question:       Is the test specimen FLIP after each 10 second excursion as to ensure that both sides of the test specimen touch the molten solder surface.

                I did not see any reference this this remark…………



Victor,