Fellow TechNetters:
Requesting clarification on the above stated TM.
Section 5.6 Using tongs, carefully remove the test specimen from the solder and place it on a piece of insulator to cool to room temperature ( see 6.3).
Question: Is the test specimen not FLIP after each 10 second excursion as to ensure that both sides of the test specimen touch the molten solder surface.
Victor,