I would appreciate some feedback on terminology. This applies to specifications for pcb laminates, coatings and encapsulants, etc.

My colleagues have come across a directive from the Institute of Electronic and Electrical Engineers (IEEE) about language, and other supporting references (https://en.wikipedia.org/wiki/Relative_permittivity). "Dielectric Constant" is now basically a struck-off/obsolete term as its meaning has become too imprecise through misuse over the years. "Relative Permittivity" is the phrase that engineers should be using rather than "dielectric constant" as it has a more precise definition of the permittivity of a material in relation to the permittivity of a vacuum.

My question is - what is in actual use at the coalface? Is this just stuff academics have said? Are you aware of this distinction? Are the latest data sheets you get still using "dielectric constant"? Some of the ones I see still use it.

Just some musings on a Friday afternoon...

Best,
Peter



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