TECHNET Archives

August 2019

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Condense Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Sender:
TechNet <[log in to unmask]>
X-To:
TechNet <[log in to unmask]>
Date:
Wed, 21 Aug 2019 08:40:59 -0500
Reply-To:
TechNet E-Mail Forum <[log in to unmask]>, Jack Olson <[log in to unmask]>
Subject:
TYPE III vs TYPE V vias
MIME-Version:
1.0
Message-ID:
<[log in to unmask]>
Content-Type:
text/plain; charset="UTF-8"
From:
Jack Olson <[log in to unmask]>
Parts/Attachments:
text/plain (10 lines) 
Greetings,
We are using thermal vias in large power device pads to carry heat through
the board to the back side.
We specified TYPE V hole filling with non-conductive, but some of the holes
are open.
If some of the vias are only partially filled, does that automatically make
it TYPE III?
Is the same MATERIAL used for TYPE III and Type V via filling?
(for the record, it is green and looks like soldermask material)

ATOM RSS1 RSS2