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Hi Bev
Wellcome back.
Association: IEEE
Event in the US: Holmes conference
Best regards
Günter
Günter Grossmann
Scientist
Empa
Swiss Federal Laboratories for Materials Science and Technology
Überlandstrasse 129
8600 Dübendorf
Switzerland
Tel +41 58 765 42 79
[log in to unmask]
www.empa.ch
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-----Ursprüngliche Nachricht-----
Von: TechNet <[log in to unmask]> Im Auftrag von [log in to unmask]
Gesendet: Donnerstag, 15. August 2019 17:54
An: [log in to unmask]
Betreff: Re: [TN] I'm baaack!
TechNetters,
Hello!
When I moved and changed internet service provider Bell Canada killed my Sympatico email account and thus my access to TechNet. We have moved to Paris (Ontario, Canada, that is) and downsized. I am still working part time for the High Density Packaging User Group (HDPUG) as a project facilitator. I am also now an Adjunct Associate Professor in the Department of Mechanical Engineering and Mechatronics at the University of Waterloo.
I mention the latter because I have a question for this esteemed group. I am teaching a course on electronics manufacturing this fall, thanks in part to info supplied by Joe Fjelstad, Dr. Ron Lasky and Dr. Michael Mayer. I am trying to put together a few slides about organizations and events the student should know about. Here is what I have so far:
Standards Organizations
IEC
IPC
ASTM
EOS/ESD Association, Inc.
Associations
IPC
SMTA
CPCA - China Printed Circuits Association
HKPCA - Hong Kong Printed Circuits Association
TPCA - Taiwan Printed Circuits Association
JPCA - Japan Printed Circuits Association
EIPC - European Institute of Printed Circuits
ASM
Consortium
iNEMI - International National Electronics Manufacturing Initiative
CALCE - Computer Aided Life Cycle Analysis
CAVE - Center for Advanced Vehicle and Extreme Environment Electronics
HDPUG - High Density Packaging User Group
Universal Consortium
Major North American Conferences
IPC APEX
ECTC
SMTAI
I would appreciate suggestions that you think I should add to these lists.
Regards,
Bev Christian
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