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April 2019

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Subject:
Re: Thin Hole Plating
From:
Jack Olson <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Jack Olson <[log in to unmask]>
Date:
Mon, 1 Apr 2019 17:37:47 -0500
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On Tue, 12 Mar 2019 17:47:32 -0400, Dennis Fritz <[log in to unmask]> wrote:

>Fischer has a range of non-destructive instruments that can measure copper
>plating in vias.  The principle is the use of eddy currents.   See this
>link and then go to a description of the instruments -

Thanks. Our lab now has an eddy current tester!

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