On a somewhat related matter, what guidance is out there for handling post-SMT mixed-technology PCBAs in WIP prior to subsequent mass soldering operations, wave and in particular selective, when the build contains one or more MSDs at, say, MSL=3 and above.

Some combination of package thickness, preheat and process temperature and time and profile, plus length of exposure between reflow and the next soldering operation may dictate the need to hold the PCBAs in WIP in a dry-store or to pre-bake prior to processing. For the low vol, high mix environment having the physical capacity and planning to do this is problematic.

Does anyone have a feel on what range of temperature/time combination is "safe" for post-SMT soldering if an MSD is close to a THT soldering site? Obviously you have to get to >100degC for flux activation, and you are allowed to bake out devices at 125degC.  J-STD-020, -033 and -075 don't really help with this.