puncture can and seal with epoxy is really a bad idea.  Did you  
contact MFG to work with their engineer?  Recall use commercial parts  
at up rate temp region - option (1) build up special box control temp  
that ensure device work within the temp range - that means not work  
at extreme temp.  (2) MFG usually got few locations for device  
manufacture, there are bined device very close to the temp range that  
screen out at burn in level - you pay more to specify in contract  
only that location with bin X device should be used (make sure your  
project MGR understand why she/he pay more and documented in design.   
so no confusion... you might need pay special qualification cost -  
not cheap)... you might have to get a special run with minimum qty to  
meet your needs (including future repair and overhaul).  IMHO.
best of luck.
jk
On Mar 26, 2019, at 12:49 PM, Watson, Howard August wrote:

> Hello TechNet,
>
> I have a problem on a Interfet 2N6550 JFET; specifically the  
> component (TO-52) failed the moisture test having >5000 ppmv. The  
> average value was around 10,000. We purchase these devices at a  
> commercial level and then "up-screen" to a JANS level. I know, this  
> is a terrible idea, but there are no JANS qualified manufacturers  
> for this device and the designers insisted on using it. This is for  
> space flight applications, and I have 500 components.
>
> We are debating mitigation strategies and came up with one that  
> would involve puncturing the can, baking out the components in a  
> nitrogen purged vacuum chamber, and re-sealing the can with a tiny  
> amount of low outgassing epoxy. Is this too pie in the sky, or is  
> there actually a known procedure to do something like this? I might  
> have watched The Martian a few too many times, but I am getting  
> desperate for a solution!
>
> Thanks!
>
> Howard A. Watson
> __________________________________________
> Intelligence & Space Research Division
> Los Alamos National Laboratory
> 30 Bikini Atoll Road
> Los Alamos, NM 87545
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