Howard,
    To take a line from Top Gun, "Gutsiest Move I've Seen"... Or something really close to that. Anyway, I don't know of any options since I never had to do that in the past, and I have worked with those Space EE's so, they want what they want. My only comment would be to be aware of FOD introduced in the package or stressing the CAN during the operation. Also if the can has glass seals to it, you could cause issues there also. I think it's a good idea, but I don't know how successful you will be with this one. Good Luck and let us know what you end up doing "if you can" that is... :-)
Later...

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Watson, Howard August
Sent: Tuesday, March 26, 2019 9:50 AM
To: [log in to unmask]
Subject: [External] [TN] Internal Vapor Analysis failure on JFET

Hello TechNet,

I have a problem on a Interfet 2N6550 JFET; specifically the component (TO-52) failed the moisture test having >5000 ppmv. The average value was around 10,000. We purchase these devices at a commercial level and then "up-screen" to a JANS level. I know, this is a terrible idea, but there are no JANS qualified manufacturers for this device and the designers insisted on using it. This is for space flight applications, and I have 500 components.

We are debating mitigation strategies and came up with one that would involve puncturing the can, baking out the components in a nitrogen purged vacuum chamber, and re-sealing the can with a tiny amount of low outgassing epoxy. Is this too pie in the sky, or is there actually a known procedure to do something like this? I might have watched The Martian a few too many times, but I am getting desperate for a solution!

Thanks!

Howard A. Watson
__________________________________________
Intelligence & Space Research Division
Los Alamos National Laboratory
30 Bikini Atoll Road
Los Alamos, NM 87545
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