Good Morning:

      A rework/component question. We deal with some high density assemblies here (high mix) and periodically we need to perform rework with our hot air station. We manage our moisture sensitive material here per J-STD-033, particularly prior to SMT reflow. However, if we have an assembly that needs rework and assuming there are moisture sensitive parts very close to the reworked part, the thought process is that the entire assembly would require baking prior to starting rework. The question is whether all SMT components are capable of withstanding a bake process of 125 degrees C for 4-48 hours without damage? I understand this is a general question, but I'm wondering if I need to pull datasheets and contact component suppliers to confirm this or if it is universally accepted that SMT parts can handle this (wishful thinking............). Thanks in advance.

Regards,
Steve Vargas