TECHNET Archives

March 2019

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Solder Paste Size
From:
"Vargas, Stephen M" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Vargas, Stephen M
Date:
Wed, 6 Mar 2019 21:56:24 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (7 lines) 
Good afternoon:

    We've got an assembly down here where I need to screen-print down to an aperture size of 6mils round (uBGA). I am using a type 4 solder paste and I'm specifying a 4 mil thick (fine grain stainless steel) stencil with a Nano coat. Boards have ENIG finish. Just wondering what success (or lack of) others are having with this type of application. Might I need to consider a move to type 5 solder paste? Anything else I should be considering? Thanks in advance.

Regards,
Steve Vargas

ATOM RSS1 RSS2