Hi Gil - yes, we published something on this as part of the IPC-4553(?)
immersion silver specification creation. The paper may be in the
specification Appendix but I'll dig thru the files and send you a copy of
the paper. If anyone wants a copy, send me an email offline from TechNet.
Dave
[log in to unmask]
On Wed, Mar 6, 2019 at 8:55 AM Gil Zilber MTH <[log in to unmask]> wrote:
> Thanks Dave,
>
> Do you have any data regarding reliability issue as a function of Silver
> contents? Or what is the maximum Silver contents that you can define as
> "safe"?
>
> Thanks,
>
> Gil
>
>
>
> *From:* David Hillman [mailto:[log in to unmask]]
> *Sent:* Wednesday, March 6, 2019 4:45 PM
> *To:* TechNet E-Mail Forum <[log in to unmask]>; Gil Zilber MTH <
> [log in to unmask]>
> *Subject:* Re: [TN] [External] [TN] SnAg component finish with SnPb
> solder past
>
>
>
> Hi Gil - Sn62 solder which contain 2% silver content, was originally used
> to slow down the diffusion of silver containing component termination
> finishes. Silver diffuses very quickly into solder and having some silver
> content in the solder alloy itself modifies those diffusion kinetics. The
> introduction of copper or nickel barrier layers on component terminations
> reduced/eliminated the need for this technique. The addition of silver does
> slightly improve the reliability of solder joints but the cost of silver in
> the solder alloy can be a negative for many companies. Bottom line - unless
> you have a large input of silver (XX%) into a solder joint, silver will not
> result in solder joint integrity degradation.
>
>
>
> Richard - any additional thoughts?
>
>
>
> Dave
>
>
>
> On Wed, Mar 6, 2019 at 8:11 AM Gil Zilber MTH <[log in to unmask]> wrote:
>
> Hi Richard,
> One more question. You said, "But in this case using Sn62 would add
> another 1% of silver to the solder joints and you would not want that."
> What is the reason? Can I understand that components that have higher
> Silver contents in their surface finish could have a reliability issue?
>
> Regards,
> Gil
> -----Original Message-----
> From: Stadem, Richard D [mailto:[log in to unmask]]
> Sent: Wednesday, March 6, 2019 3:53 PM
> To: Gil Zilber MTH <[log in to unmask]>; TechNet E-Mail Forum <
> [log in to unmask]>
> Subject: RE: [External] [TN] SnAg component finish with SnPb solder past
>
> I don't think so. Sn62 would be better if the part was being soldered to a
> surface that is sintered silver, to help limit leaching of the sintered
> silver surface. But in this case using Sn62 would add another 1% of silver
> to the solder joints and you would not want that. I would use Sn63.
>
> -----Original Message-----
> From: Gil Zilber MTH [mailto:[log in to unmask]]
> Sent: Wednesday, March 06, 2019 7:47 AM
> To: Stadem, Richard D; TechNet E-Mail Forum
> Subject: RE: [External] [TN] SnAg component finish with SnPb solder past
>
> Thanks Richard,
> I was hesitated only because of the Silver. Will it be better to use Sn62
> and not Sn63?
> Thanks,
> Gil
>
> -----Original Message-----
> From: Stadem, Richard D [mailto:[log in to unmask]]
> Sent: Wednesday, March 6, 2019 3:16 PM
> To: Gil Zilber MTH <[log in to unmask]>; TechNet E-Mail Forum <
> [log in to unmask]>
> Subject: RE: [External] [TN] SnAg component finish with SnPb solder past
>
> Gil,
> I don't really see an issue with soldering that part. It is basically a
> SOT89 package with compliant leads and a large bottom pad. There would be
> plenty of solder volume to absorb the small amount of silver, and the part
> is not going to be affected by huge delta Ts as it is quite small. Nothing
> jumps out at me that indicates a potential issue. We solder lots of those
> and I have not seen any problems. You may see some voids in an X-ray
> because of the large flat pad, but they do not typically pose any
> reliability issue. Is there anything that is making you hesitate?
> Odin
>
> -----Original Message-----
> From: Gil Zilber MTH [mailto:[log in to unmask]]
> Sent: Wednesday, March 06, 2019 1:50 AM
> To: Stadem, Richard D; TechNet E-Mail Forum
> Subject: RE: [External] [TN] SnAg component finish with SnPb solder past
>
> Hi,
> It is a monolithic amplifier (GVA-84+ from mini-circuits) case style:
> DF782 Thanks, Gil
>
> -----Original Message-----
> From: Stadem, Richard D [mailto:[log in to unmask]]
> Sent: Tuesday, March 5, 2019 8:39 PM
> To: TechNet E-Mail Forum <[log in to unmask]>; Gil Zilber MTH <
> [log in to unmask]>
> Subject: RE: [External] [TN] SnAg component finish with SnPb solder past
>
> What type of component is it?
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Gil Zilber MTH
> Sent: Tuesday, March 05, 2019 11:40 AM
> To: [log in to unmask]
> Subject: Re: [TN] [External] [TN] SnAg component finish with SnPb solder
> past
>
> Hi dave,
> It is 1-3% silver.
> Thanks.
> Gil
>
>
> -------- הודעה מקורית --------
> מאת: David Hillman <[log in to unmask]>
> תאריך: 4.3.2019 23:12 (GMT+02:00)
> אל: TechNet E-Mail Forum <[log in to unmask]>, Gil Zilber MTH <
> [log in to unmask]>
> נושא: Re: [External] [TN] SnAg component finish with SnPb solder past
>
> Hi Gil - what is the composition of the SnAg plating?
>
> Dave Hillman
> Collins Aerospace
> [log in to unmask]<mailto:[log in to unmask]>
>
> On Mon, Mar 4, 2019 at 9:23 AM Gil Zilber MTH <[log in to unmask]<mailto:
> [log in to unmask]>> wrote:
> Hello,
> Does anyone know if there is an issue of soldering components that have
> SnAg finish with SnPb solder paste?
>
> Thanks,
> Gil Zilber
> Process Engineer at IAI
>
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