are those high volume product or just one or two panels?
jk
On Feb 7, 2019, at 10:07 AM, Tom Brendlinger wrote:

> Unfortunately I don't have XRF capability in house. I'm hoping to get
> approval to send it out.
>
> Interesting theory Steve. The only thing about that theory that I  
> don't
> understand is why it would be in the same location on two boards,  
> but not
> on the rest. It's possible that it was just luck, but it isn't a super
> satisfying answer. I'll see what analysis I can get approved and if it
> supports that theory.
>
> Thank you!
> Tom
>
> On Thu, Feb 7, 2019 at 7:51 AM Steve Herring  
> <[log in to unmask]>
> wrote:
>
>> Is it possible there was a glass fiber on that area when it was  
>> plated,
>> leaving you with the original copper foil thickness?
>> The fiber was then removed prior to ENIG?
>>
>> My guess at the cause.
>>
>> Steven E Herring
>> Director of Engineering
>> Pennatronics Corp
>>
>> -----Original Message-----
>> From: TechNet [mailto:[log in to unmask]] On Behalf Of FTL Quality
>> Sent: Thursday, February 07, 2019 3:07 AM
>> To: [log in to unmask]
>> Subject: Re: [TN] "Wrinkle" on outer copper layer
>>
>> Are you able to complete an XRF analysis on the Nickel thickness  
>> of the
>> ENIG?
>>
>> -----Original Message-----
>> From: Tom Brendlinger
>> Sent: Wednesday, February 6, 2019 8:36 PM
>> To: [log in to unmask]
>> Subject: [TN] "Wrinkle" on outer copper layer
>>
>> Hello TechNet,
>>
>> I've recently received some boards that have a defect I've never seen
>> before.
>>
>> There is a linear depression in a 2oz outer copper layer on two  
>> out of 45
>> boards. One of the boards was on a solder sample panel, the other was
>> assembled with the defect.
>>
>> The depression has the appearance of a wrinkle or groove, it is
>> approximately straight and square to the edge of the board. At its  
>> widest
>> point it is about 0.006" wide, and as far as we can measure it is  
>> between
>> 0.0015" and 0.002" deep. There are a couple of small delaminations  
>> nearby
>> (on a panel that has not been reflowed).
>>
>> I looked through IPC-A-600 and did not find anything about this  
>> type of
>> issue. I don't have the equipment to microsection or x-ray the  
>> board, so
>> I'm not sure whether the foil is damaged under the plating (Which  
>> is RoHS
>> ENIG).
>>
>> Hopefully this image link works:
>> https://snag.gy/Kx58Oy.jpg
>>
>> Please let me know if you've seen this before or otherwise know  
>> how I can
>> find more information.
>>
>> Thank you!
>> Tom Brendlinger
>> Senior Electrical Engineer
>> Superpedestrian, Inc.
>>