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Subject:
From:
Mary Davis <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Mary Davis <[log in to unmask]>
Date:
Tue, 4 Dec 2018 01:19:53 +0000
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Refer to MIL-STD-1130 Wrapped Wire Termination and to ECSS-Q-70-30A Space Product Assurance





-----Original Message-----

From: TechNet <[log in to unmask]> On Behalf Of Larry Dzaugis

Sent: Monday, December 3, 2018 2:18 PM

To: [log in to unmask]

Subject: Re: [TN] Wire wrapped terminations



https://docs-emea.rs-online.com/webdocs/0f3f/0900766b80f3f2aa.pdf.

Wire Wrap tool with wire and spacing requirements.

Wire tension is important, Do not know how to measure after wrap.



Technology from the 50's.

Works and has limited applications.

Joint will not reflow when run through a heat process.



Connecting rather than soldering technology.





On Mon, Dec 3, 2018 at 4:43 PM Gumpert, Ben <[log in to unmask]> wrote:



> TechNetters,

>

> Is anyone familiar with what I'll call 'wire wrapped terminations'?

>

> Such as:

>

> https://www.mouser.com/ProductDetail/Coiltronics-Eaton/CTX300-4-R?qs=y

> zwxPInThYQ4vFyw6jLRIQ%3D%3D 

> http://www.vishay.com/docs/34069/lpt4545.pdf

> https://products.pulseelex.com/product-details/p0926nl/163/

>

> A request came up at the last J-STD-001 committee meeting for solder 

> joint criteria on these types of terminations, but without any suggestions.

> I can't find anything from the vendors for a recommendation. Does 

> anyone know of any testing done with these parts, or know of some 

> recommended solder joint criteria?

>

> Ben

>


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