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November 2018

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Subject:
Re: Plated shut vias
From:
"Stadem, Richard D" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D
Date:
Thu, 8 Nov 2018 19:07:07 +0000
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My experience is that the little dimple does or can induce a void in the finished solder joint, but that does not necessarily affect reliability. But I don't like it anyway!

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Steven Kelly
Sent: Thursday, November 08, 2018 9:11 AM
To: [log in to unmask]
Subject: [TN] Plated shut vias

Hi All,
With new plating systems one can plate a micro via shut but it leaves usually a small dimple of approx.. 13 microns. Have any studies been done on the effect this dimple has on the reliability of BGA's? Thanks. Steve Kelly

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