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November 2018

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Subject:
Re: Plated shut vias
From:
Steven Kelly <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steven Kelly <[log in to unmask]>
Date:
Thu, 8 Nov 2018 19:02:16 +0000
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From: Steven Kelly
Sent: November-08-18 10:11 AM
To: TechNet E-Mail Forum <[log in to unmask]>
Subject: Plated shut vias

Hi All,
With new plating systems one can plate a micro via shut but it leaves usually a small dimple of approx.. 13 microns. Have any studies been done on the effect this dimple has on the reliability of BGA's? Thanks. Steve Kelly

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