Since no two designs are the same, figuring this out requires some 
testing.

IPC-9704 shows you how to calculate the strain, and limits for different 
fab thickness. Depanelling causes strain due to fab bending. The strain 
curves for v-score or tabs look very different, but measurement  of nearby 
parts can determine the strain and strain rate, and the limits according 
to IPC-9704. 

This led us to develop our DFM rules for layout that can avoid failures 
due to processes like depanelling, installing screws and boards into 
enclosures.


Roger Mack  P.Eng. 
Manufacturing Specialist
Parker Hannifin Canada
Electronic Controls Division
1305 Clarence Avenue
Winnipeg, MB  R3T 1T4 Canada 
direct 204 453 3339 x7373
[log in to unmask]
www.parker.com/ecd







From:   Jack Olson <[log in to unmask]>
To:     <[log in to unmask]>
Date:   2018-11-19 08:34 AM
Subject:        [TN] depanelization
Sent by:        TechNet <[log in to unmask]>



Is there any IPC document that addresses the METHOD of depanelization?
(we have an array of assemblies in pallet form with break-away tabs)

I found the acceptability of the RESULT of depanelization in IPC-A-610
10.2.8,
but that does not address the risk of the method (stress on components and
solder joints,etc).




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