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November 2018

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Subject:
Re: Via Type VII
From:
Tan Geok Ang <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Tan Geok Ang <[log in to unmask]>
Date:
Mon, 12 Nov 2018 02:15:21 +0000
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text/plain
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text/plain (15 lines) 
wrap thickness will be the key requirement for your considerations.
________________________________________
From: TechNet [[log in to unmask]] on behalf of haviv gendelis [[log in to unmask]]
Sent: Monday, 12 November, 2018 2:11:10 AM
To: [log in to unmask]
Subject: [TN] Via Type VII

What is the recommended cooper thickness over the via fill for type VII via.

Thanks

Haviv

Sent from my iPad

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