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Subject:
From:
"Stadem, Richard D" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D
Date:
Fri, 9 Nov 2018 14:31:33 +0000
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text/plain (28 lines)
I do have a pre-released version that may help you, in the meantime, attached.


From: Ricardo Moncaglieri [mailto:[log in to unmask]]
Sent: Friday, November 09, 2018 6:04 AM
To: Stadem, Richard D; [log in to unmask]
Subject: Re: [TN] THANKS

Richard,
Appreciate your support.
Keep awaiting. I am going to review too my folders if I have the HDK-850....

Note:
There was a listserv trouble which was already solved. That was the reason of low traffic on TechNet.....
brgds,Ricardo
>>> "Stadem, Richard D" <[log in to unmask]> 08/11/2018 16:03 >>>
Ricardo, there is one more document I am trying to download that may be very helpful to you. It is IPC-HDBK-850 which provides a wealth of information on staking, encapsulation, bonding, and coating methods, materials, tools used, etc.
I wrote most of this standard a few years ago but someone took my only copy of the released document, and I cannot get onto the system where the soft copy is stored. I will send it to you as soon as I can get it.
dean

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ricardo Moncaglieri
Sent: Wednesday, November 07, 2018 10:50 AM
To: [log in to unmask]
Subject: [TN] THANKS

THANKS

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