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November 2018

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Subject:
From:
Ricardo Moncaglieri <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Ricardo Moncaglieri <[log in to unmask]>
Date:
Fri, 9 Nov 2018 09:03:58 -0300
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Richard,
Appreciate your support.
Keep awaiting. I am going to review too my folders if I have the HDK-850....
 
Note:
There was a listserv trouble which was already solved. That was the reason of low traffic on TechNet.....
brgds,Ricardo
>>> "Stadem, Richard D" <[log in to unmask]> 08/11/2018 16:03 >>>
Ricardo, there is one more document I am trying to download that may be very helpful to you. It is IPC-HDBK-850 which provides a wealth of information on staking, encapsulation, bonding, and coating methods, materials, tools used, etc. 
I wrote most of this standard a few years ago but someone took my only copy of the released document, and I cannot get onto the system where the soft copy is stored. I will send it to you as soon as I can get it. 
dean 
 
-----Original Message----- 
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ricardo Moncaglieri 
Sent: Wednesday, November 07, 2018 10:50 AM 
To: [log in to unmask] 
Subject: [TN] THANKS 
 
THANKS 

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