TECHNET Archives

November 2018

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Steven Kelly <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Steven Kelly <[log in to unmask]>
Date:
Thu, 8 Nov 2018 19:27:07 +0000
Content-Type:
text/plain
Parts/Attachments:
text/plain (26 lines)
Thanks Ed,
If I do a SEM/EDX do you know what I should be looking for? Regards Steve

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ed Hare
Sent: November-08-18 2:03 PM
To: [log in to unmask]
Subject: Re: [TN] Immersion gold thickness per 4552

Steven,

I believe it means that at higher gold thicknesses there is a higher probability of hyper-etching of the EN by the gold bath.

------------------------
Ed Hare
[log in to unmask]




> On Nov 8, 2018, at 7:03 AM, Steven Kelly <[log in to unmask]> wrote:
> 
> Hi all,
> Is it normal to obtain thickness readings of approx. 2.5 microinches of gold on large pads and 5 microinches on small pads across a panel ? What does it mean under paragraph 3.2.2 that higher gold thickness (>4.925 microinches) may compromise the integrity of the nickel undercoat?
> Thanks in advance. Steve Kelly

ATOM RSS1 RSS2