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Sender:	TechNet <[log in to unmask]>
X-To:	TechNet E-Mail Forum <[log in to unmask]>, Ricardo Moncaglieri <[log in to unmask]>
Date:	Thu, 8 Nov 2018 19:03:48 +0000
Reply-To:	TechNet E-Mail Forum <[log in to unmask]>, "Stadem, Richard D" <[log in to unmask]>
Message-ID:	<[log in to unmask]>
Subject:	Re: THANKS
From:	"Stadem, Richard D" <[log in to unmask]>
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Ricardo, there is one more document I am trying to download that may be very helpful to you. It is IPC-HDBK-850 which provides a wealth of information on staking, encapsulation, bonding, and coating methods, materials, tools used, etc.
I wrote most of this standard a few years ago but someone took my only copy of the released document, and I cannot get onto the system where the soft copy is stored. I will send it to you as soon as I can get it.
dean

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Ricardo Moncaglieri
Sent: Wednesday, November 07, 2018 10:50 AM
To: [log in to unmask]
Subject: [TN] THANKS

THANKS

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