From: Steven Kelly
Sent: November-08-18 10:11 AM
To: TechNet E-Mail Forum <[log in to unmask]>
Subject: Plated shut vias
Hi All,
With new plating systems one can plate a micro via shut but it leaves usually a small dimple of approx.. 13 microns. Have any studies been done on the effect this dimple has on the reliability of BGA's? Thanks. Steve Kelly