Hi Wayne - we are on the same page. Whether the cabinet is one of the
industry specials or just a sealed desiccated unit, the key parameter is to
keep the boards dry and not further degrade the solderability. IPC-1601 is
a great reference for folks to use to understand the concerns and can be
the base for setting  up a workable system.  There is now discussions on
the potential of having a "board MSL" similar to the component MSL system -
lots of things to work out, testing to be done and data to be sorted but
perhaps in the future we'll have a more uniform characterized/classified
system to describe boards and moisture.

Dave

On Wed, Sep 12, 2018 at 9:44 AM, Wayne Showers <[log in to unmask]
> wrote:

> Thanks Dave,
> Methinks a few misnomers were attributed to me unfairly, but that is OK as
> long as the discussion moves forward.
>
> My recommendation, and I will change my response format on future posts
> accordingly, is as follows:
> 1. Cite the appropriate standard
>     > Use IPC-1601, Printed Board Handling and Storage Guidelines, as the
> foundation document.
> 2. If it needs additional information, fill out a standards improvement
> form.
>     > Provide context and data when available.
> 3. Clarify terminology used.
>     > This one is sometimes most important as the same term means
> different things in various points along the chain.  My perfect example is
> 'Panel.'  A lot of manufacturers use the term panel when they mean array
> and this conflicts with the PCB fabricators as the Panel is the Master or
> Shop Panel.  Also, for me a dry chamber is a desiccant (unheated, low
> humidity) chamber.  I think this is what caused the most confusion on this
> particular thread.
>