Keep in mind also the terminal finishing.....
One reflow or two reflow ? etc

Too  early to fix a reliable IMC thickness ..... too many variables playing !!!

GS


-----Messaggio originale-----
Da: TechNet [mailto:[log in to unmask]] Per conto di Guy Ramsey
Inviato: mercoledì 5 settembre 2018 19:34
A: [log in to unmask]
Oggetto: Re: [TN] Ni intermetallic thickness target

ENEPIG

On Wed, Sep 5, 2018 at 1:17 PM Stadem, Richard D <[log in to unmask]>
wrote:

> What is the finish plating?
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of Guy Ramsey
> Sent: Wednesday, September 05, 2018 11:59 AM
> To: [log in to unmask]
> Subject: [TN] Ni intermetallic thickness target
>
> Recently, I was reviewing a lab report. It concluded that the 
> manufacturer should increase the IMC thickness as a part of process changes . . .
> It stated that, while there are no industry specifications for IMC 
> thickness it s generally accepted that for Pb-free assemblies the IMC 
> thickness should be in the 20 to 120 uin range. It seems to be 
> critical of a process that produces IMC between 10 and 70 uin on pads 
> across a single device.
> Does anybody have reference papers or texts that would support this 
> target and process critique?
>