Recently, I was reviewing a lab report. It concluded that the manufacturer
should increase the IMC thickness as a part of process changes . . .
It stated that, while there are no industry specifications for IMC
thickness it s generally accepted that for Pb-free assemblies the IMC
thickness should be in the 20 to 120 uin range. It seems to be critical of
a process that produces IMC between 10 and 70 uin on pads across a single
device.
Does anybody have reference papers or texts that would support this target
and process critique?