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September 2018

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Subject:
From:
Richard Kraszewski <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Richard Kraszewski <[log in to unmask]>
Date:
Thu, 20 Sep 2018 21:54:50 +0000
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I have a situation where  concern has been raised that shipment of a conductive  adhesive in dry ice has caused abnormal adhesive performance (Voiding/outgassing) during cure. 
To my recollection,  it was thought to be a best practice to ship under-fills, glob tops, etc. in a foil bag when using dry ice due to similar issues/concerns. Thought was that CO2  could penetrate common plastic bags but not foil  (heat seal) bags. 

I would appreciate any and all thoughts/experiences on this matter.
Both supporting or disputing this line of thinking. 

Many thanks in advance. 

Rich  Kraszewski 
Plexus - Senior Staff Process Engineer
Phone: (920) 969-6075

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