Good morning everyone,

We're quoting this little 1.5" X 2.5" assembly that has a TDK/InvenSense
6-axis MEMS Gyroscope/Accelerometer on it (PN# ICM-20648). I've not
assembled a board with one of these devices on it before. When I read the
datasheet, and then the handling guidelines for these parts (
http://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf
) I was quite surprised how fragile these things are seeing how they are
primarily used on wearable devices where they are going to see a lot of
shock. Yeah I know it is a MEMS part, but it would seem to me if it can
survive all the abuse it will see being in a wearable device that it would
be a little more robust during assembly.

So have any of you who have placed these sort of devices, have to make a
bunch of changes in their standard assembly processes and stockroom
handling practices to accommodate these parts?

Thanks in advance,

Steve
-- 
Steve Gregory
Kimco Design and Manufacturing
Process Engineer
(208) 322-0500 Ext. -3133

-- 



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