TECHNET Archives

September 2018

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
David Hillman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, David Hillman <[log in to unmask]>
Date:
Thu, 20 Sep 2018 06:57:28 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (24 lines)
Hi Ben - yes, there are differences in the mechanical properties and the
solder joint microstructures for the "high temp" alloys. Most of those
alloys have applications in component construction, specifically in
component die attachment. One very common alloy used frequently in a number
of applications is the 10Sn88Pb2Ag alloy.

Dave Hillman
Rockwell Collins
[log in to unmask]

On Thu, Sep 20, 2018 at 6:40 AM, Gumpert, Ben <[log in to unmask]> wrote:

> TechNetters,
>
> J-STD-006 has a series of 'high temp' SnPb alloys (some with Ag) that are
> close in SOL/LIQ temps. I'm familiar with Sn10Pb90 as a common high-temp
> ball on ceramic BGAs, but I haven't seen the others used. Are there any
> differences (e.g. mechanical properties) among these that would drive
> selection, other than the SOL/LIQ?
> Are some alloys more readily available than others?
>
> Ben
>

ATOM RSS1 RSS2