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Subject:
From:
SALA GABRIELE <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, SALA GABRIELE <[log in to unmask]>
Date:
Wed, 29 Aug 2018 22:00:38 +0200
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Just in advance, it seems IPC-9241 does not mention about Back Plating...

Gabriele

-----Messaggio originale-----
Da: TechNet [mailto:[log in to unmask]] Per conto di Stadem, Richard D
Inviato: mercoledì 29 agosto 2018 21:36
A: [log in to unmask]
Oggetto: Re: [TN] Thin gold cross section measurement

There is an excellent IPC standard, IPC-9241 Guidelines for Microsection
Preparation, but I cannot remember if it discusses Back Plating and I do not
have a copy here in front of me. When I get back Monday I will check.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of
[log in to unmask]
Sent: Wednesday, August 29, 2018 1:53 PM
To: [log in to unmask]
Subject: [TN] Thin gold cross section measurement
Importance: High

Fellow TechNetters:

   Is there an IPC Standard and/or guideline line which stats or recommend
that if thin gold plating is to be measured by cross section then Back
Plating Process should be conducted.


Victor,


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