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August 2018

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Subject:
From:
"Stadem, Richard D" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum <[log in to unmask]>, Stadem, Richard D
Date:
Wed, 29 Aug 2018 19:35:35 +0000
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There is an excellent IPC standard, IPC-9241 Guidelines for Microsection Preparation, but I cannot remember if it discusses Back Plating and I do not have a copy here in front of me. When I get back Monday I will check.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of [log in to unmask]
Sent: Wednesday, August 29, 2018 1:53 PM
To: [log in to unmask]
Subject: [TN] Thin gold cross section measurement
Importance: High

Fellow TechNetters:

   Is there an IPC Standard and/or guideline line which stats or recommend that if thin gold plating is to be measured by cross section then Back Plating Process should be conducted.


Victor,

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